Delivery Lead Time:
Part A—25 KG/Bucket, Part B—5 KG/ Pot.
- Credit Card
- Western Union
13000 Ton per Year
SE2205 is two-component solvent-free room temperature curing epoxy potting adhesive with good thermal conductivity.
1.Good toughness, high hardness
2.Excellent adhesion, anti-cracking property
3.Excellent electrical insulating properties, and stability
4.Good waterproof, moisture resistance, very low water absorption
5.Good temperature resistance, with 0.9 W/mK thermal conductivity
For potting protection of high-power electronic components, modules, electric tools, instrumentation, automotive electronics and circuits boards which require high thermal conductivity.
#Directions for Use
1.Stirring A component evenly before taking use.
2.Mix A, B two components with 5:1 mass ratio, stir well and do vacuum defoaming before potting to components.
3.If necessary, continue to vacuum defoaming for components which been potted, help to increase the electrical performance of the device.
4.Curing conditions: Preliminary curing time is 8 hours at room temperature, completely cured need 24 hours; also can be heat curing, in 80°C for 2~3 hours.
5.The above tests are measured under 120g mixture of adhesive.
#Packing and Storage
SE2205 Black color Part A—25 KG/Bucket, Part B—5 KG/ Pot.
When stored at or below 25°C in the original unopened containers, this product has a usable life of 12 months from the date of production.
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